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直流平面磁控(DC-PM)溅射沉积的司太立合金薄膜经电子束熔凝处理后,可获得与基体具有良好冶金结合的包复层。包复层中钨的含量,晶粒尺寸以及被基体稀释的程度将影响包复层的显微硬度。
After the deposition of Stellite thin film by DC-PM magnetron sputtering, the clad layer with good metallurgical bond with the matrix can be obtained by electron beam welding. The content of tungsten in the cladding layer, the grain size and the degree of dilution by the matrix will affect the microhardness of the cladding layer.