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采用高功率复合脉冲磁控溅射技术(HPPMS)在316不锈钢、硬质合金基体上沉积了TiN薄膜,研究不同N2流量下TiNx膜层的沉积速率、硬度、晶体生长取向、摩擦磨损等性能,并在相同的平均靶电流下与直流磁控溅射制备的TiN薄膜对比。结果表明:HPPMS制备的膜层更加致密,在氩氮流量比为7.4:1时膜层显微硬度达2470 HV,晶粒尺寸也明显小于直流磁控溅射制备的TiN,摩擦磨损性能也得到了改善。
TiN thin films were deposited on 316 stainless steel and cemented carbide substrate by HPPMS. The deposition rate, hardness, crystal growth orientation and friction and wear properties of TiNx films were studied under different N2 flow rates. And compared with TiN films prepared by DC magnetron sputtering at the same average target current. The results show that the film prepared by HPPMS is denser, the microhardness of the film is 2470 HV when the argon-nitrogen flow ratio is 7.4: 1, and the grain size is also obviously smaller than that of TiN prepared by DC magnetron sputtering. The friction and wear properties are also obtained Improved.