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介绍了一种超微细加工新方法－ＬＩＧＡ技术，并就ＬＩＧＡ技术对掩模材料、光刻胶和光源的要求予以讨论，同时还介绍了国外在这方面的最新研究成果。ＬＩＧＡ技术是深度Ｘ射线刻蚀、电铸成型和塑料铸模等技术相结合的综合技术，是制造微型机械最有前途的方法。与传统半导体超微细加工方法相比，ＬＩＧＡ技术有以下优点：（１）用材广泛，可以是金属、陶瓷、聚合物及玻璃；（２）可加工任意复杂的图形结构；（３）可制造有较大高宽比的超微细元件；（４）加工精度高，可达亚微米；（５）可重复复制，工业上能批量生产，成本低。
A new method of ultrafine processing (LIGA) is introduced. The requirements of LIGA for mask material, photoresist and light source are also discussed. At the same time, the latest research results in this field are also introduced. LIGA technology is a combination of deep X-ray lithography, electroforming and plastic mold technology and is the most promising method for manufacturing micromachining. Compared with the traditional semiconductor ultrafine processing method, LIGA technology has the following advantages: (1) wide range of materials, which can be metal, ceramic, polymer and glass; (2) can process any complex graphic structure; (3) Large aspect ratio of ultra-fine components; (4) high precision, up to sub-micron; (5) repeatable, industrial mass production, low cost.