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安森美半导体推出PIn PAK(电源集成封装)技术。该技术包括装配模拟驱动器裸片于标准 QFN 封装内。然后该模拟 QFN 连同两块 MOSFET 裸片共同封装在一个主电源QFN 导线架内。整个模块以 Mold Array Process(MAP)塑模。率先采用该封装的 NIS3001由 QFN 封装的 CMOS 模拟门驱动器 NCP5351和两个MOSFET 裸片组成。
ON Semiconductor introduced PIn PAK (power integrated package) technology. The technology includes the assembly of analog driver die in a standard QFN package. The analog QFN is then packaged together with two MOSFET die in a main power QFN leadframe. The entire module is Mold Array Process (MAP). The NIS3001 pioneered the package consisting of the QFN CMOS analog gate driver NCP5351 and two MOSFET dies.