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为了解决多层板胶接结构和带垫板蜂窝结构的质量检验,从一侧测出多层胶接结构的脱粘伤并能大致给出脱粘伤的脱粘深度,我们于1978年底研制成功了XJJ—1谐振胶接检验仪。该仪器属声阻检测的—种。仪器全套设备主要包括电子仪器和换能器。实物照片如图1。
In order to solve the quality inspection of the multi-layer glued structure and the honeycomb structure with a backing plate, the debonding of the multi-layer adhesive structure can be detected from one side and the debonding depth of the debonding can be roughly given. We developed it at the end of 1978 Successful XJJ-1 resonant glue tester. The instrument is a kind of acoustic impedance detection. A full set of equipment, including electronic equipment and transducers. Physical photo shown in Figure 1.