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为什么热风整平焊锡防护层仍有活力的三个看法A Defense of Hot Air Solder Leveling:Three Perspectiveson Why It is Still a Viable Solution 本文是三个热风整平焊锡(HASL)设备供应商谈HASL仍然有活力存在的理由。看法一认为:HASL系统进入自动化,各个工序操作和工艺参数控制都能达到自动化,操作简便和生产效率高。设备的结构不断改进,可得到不同锡铅厚度层,HASL工艺仍有许多优点。看法二认为:至今在全部印制板生产中应用HASL的占有70％～80％,其功效优点和局限性都是显而易见的,仍将被长期应用。看法三认为:HASL自1979年出世以来一直受重用,印制板设计者和制造者都视HASL是可靠朋友,会进一步获得应用。(By Dave Cbrey等CircuiTree 2002/11共3页)
Why Hot Air Leveler Solder Shields Are Still Alive Three Opinions This article is about three hot air flat solder (HASL) equipment suppliers talk about HASL still alive The reason One view: HASL system into automation, all process operations and process parameters control can be automated, easy to operate and high production efficiency. The structure of the device is continuously improved and different SnPb thicknesses can be obtained. There are still many advantages to the HASL process. View two that: so far in all printed circuit board production HASL occupy 70% to 80%, its advantages and limitations are obvious, and will still be long-term application. Opinion III: HASL has been reused since it was born in 1979, and both board designers and manufacturers regard HASL as a reliable friend for further applications. (By Dave Cbrey et al. CircuiTree 2002/11 of 3)