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利用扫描电镜、强度测试仪研究了键合铜线无卤直接镀钯工艺及镀钯键合铜线性能,分析了涂覆速度、热处理及张力对直接镀钯铜线拉断力、伸长率和表面质量的影响。结果表明:无卤直接镀钯工艺可获得镀层均匀的镀钯键合铜线;涂覆速度为80~90 m/min时,镀钯铜线具有适当的厚度和良好的表面质量;随热处理温度提高,直接镀钯铜线拉断力降低,伸长率增加;当热处理温度为450℃时,表面钯原子扩散速率加快,线材强度增加,其表面颜色由金属钯色变为灰铜色;当热处理温度为470℃时,镀钯铜线晶粒粗大,力学性能降低;热处理过程中张力小于0.020 N导致线材表面机械损伤,张力大于0.035 N时造成线材表面波浪纹缺陷。当热处理温度为430℃,张力为0.025~0.030 N时,0.020 mm镀钯铜线具有优异的性能。
Palladium-free palladium directly bonding process and palladium-bonded copper wire properties were studied by scanning electron microscope and intensity tester. The effects of coating speed, heat treatment and tension on the tensile strength, elongation And the effect of surface quality. The results show that palladium-plated copper wire has proper thickness and good surface quality at the coating speed of 80 ~ 90 m / min, When the heat treatment temperature is 450 ℃, the diffusion rate of palladium atoms on the surface is accelerated and the strength of the wire increases. The color of the surface is changed from metallic palladium to gray copper. When When the heat treatment temperature is 470 ℃, the grains of Pd-plated copper wire are coarse and the mechanical properties are reduced. The tension less than 0.020 N during the heat treatment leads to mechanical damage on the wire surface. When the tension is more than 0.035 N, the wire surface waviness is caused. When the heat treatment temperature is 430 ℃ and the tension is 0.025 ~ 0.030 N, the 0.020 mm palladium-plated copper wire has excellent performance.