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US2 010 178 499(2010-07-15)。半导体晶片薄而脆,其在磨削或切割中若遇外力作用时易断裂;为除去晶片磨削时所产生的粉末和热量,需向晶片
US 2 010 178 499 (2010-07-15). Thin and brittle semiconductor chips, grinding or cutting in the event of external force in case of fracture easily; in order to remove the powder generated during wafer grinding and heat, the need to wafer