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RCA公司最近研制成功保护硅片的新方法,使硅片在未封装前就可以做到完全密封。通常,集成电路是采用适当而昂贵的封装来获得最佳密封性能的。另外,也有利用氮化物或二氧化硅钝化以及玻璃钝化的先进方法。但是,RCA公司认为三层金属的新方法却更先进得多。这一新方法,是采用几个保护夹层来保护硅和以金实现的内引线而获得密封性的。这样,片子最后就可以毫无问题地进行塑料封装,甚至完全可以不封壳。另外,尽管这种密封保护方式要附加金和铂的处理,但是,据说其成本却因生产能力的提高而同通常的片子或集成电路的成本完全一样。RCA确认,两个通常工艺的741典型运算放大器的成本和三层金属法的成本是一样的。
RCA recently developed a new method of protecting silicon wafers so that they can be completely sealed before they are packaged. In general, integrated circuits use the proper and expensive package for optimal sealing performance. In addition, advanced methods utilizing nitride or silica passivation and glass passivation are also available. However, RCA believes the new three-layer approach is far more advanced. This new method uses several protective interlayers to protect the inner leads from silicon and gold. In this way, the final piece of the film can be plastic packaging without problems, or even can not encapsulate. In addition, although the seal protection method requires the addition of gold and platinum, its cost is said to be exactly the same as that of a conventional film or integrated circuit because of its increased productivity. RCA confirmed that the cost of two typical 741 typical op amps is the same as the three-metal method.