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由于火箭技术、宇宙航行以及医用电子学等科学部门的发展,对电子工业提出了微小型化、高可靠性以及耐恶劣条件等要求.微小型化的方案大致可分为三种:第一种是尽量缩小各种元件的体积,并制成外形大致相同、便于装配的形状,以提高装配密度,缩小无线电设备的体积.但因仍需许多用于装配目的的结构,所以这种方案所能达到的微小型化程度并不高;微小型化的第二种方案是所谓薄膜电路(二维方式),它是把回路中的各个元件以及引纡等都以薄膜的形式做在同一块基体板上.在薄膜电路中,半导体器件一般是另外制出的,因为要在同一块基体板上制出半导体器
Due to the development of scientific departments such as rocket technology, space navigation and medical electronics, the miniaturization, high reliability and resistance to harsh conditions have been proposed for the electronics industry.Micro-miniaturization programs can be broadly divided into three types: the first Is to minimize the size of the various components and to create a shape that is roughly the same shape and easy to assemble to increase the assembly density and reduce the size of the radio equipment but because of the many structures required for assembly purposes To achieve the degree of miniaturization is not high; miniaturization of the second program is the so-called thin-film circuit (two-dimensional mode), which is the circuit in the various components and cited in the form of thin film in the same matrix In the thin-film circuit, the semiconductor device is generally produced separately, because the semiconductor substrate to be made in the same piece of the substrate