34 GHz Bandpass Filter for Low-temperature Co-fired Ceramic System-in-Package Application

• 作 者: XU Ziqiang SHI Yu ZENG Zhiyi L
• 机 构: ResearchInstituteofElectronicScienceandTechnology,StateKeyLaboratoryofElectronicThinFilmsandIntegrat
• 出 处: 中国机械工程学报
• 发表日期: 2011年2期
• 关键词: 带通滤波器 低温共烧陶瓷 系统级封装 应用 GHZ 小型化设计 微带谐振器 多层结构 three-dimensional（3D） structure band
• 基金项目: supported by Research Fund for the Doctoral Program of Higher Education of China（Grant No.20060614021）, Sichuan Provincial Fundamental Research of China（Grant No.2008JY0057） , Fundamental Research Fun

<正>Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filte