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基于散热器载覆芯片(COHS)封装光源的模块为研究对象,建立了有限元模型,以有限元分析软件Flo EFD和测温实验为平台,模拟分析了光源模块从启动到稳定工作过程中的温度分布,并对实际光源模块的几个特征点进行了温度测试。结果表明除了在散热器边沿测试点的模拟计算结果与实测结果之间有所偏差外,其他特征点的结果吻合很好,模拟分析的方法及结果符合热分析要求。分析数据和研究结果为今后研究大功率LED灯具的模块化、系列化提供了参考依据。
Based on COHS package light source module, a finite element model was established. By using the finite element analysis software Flo EFD and temperature measurement experiment as a platform, the simulation and analysis of the light source module from start to stable operation Temperature distribution, and several features of the actual light source module temperature test. The results show that the results of the other characteristic points are in good agreement with the results of the simulation except that the simulation results at the edge of the heat sink are not in good agreement with the measured results. The simulation analysis results and the results meet the thermal analysis requirements. The analysis of data and research results provide a reference for the future research of modularization and serialization of high power LED lamps.