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引言在探讨电子元器件引线可焊性影响因素的研究工作中,人们越来越注意引线镀层表面性质(包括表面抗氧化性)所带来的影响。国内一些研究工作者指出,铜锡间金属化合物只有暴露于空气中并与空气充分作用后,才影响引线可焊性。在常规老化条件下,可焊性下降的主要原因是镀层表面的氧化。作者也曾通过试验证明,在真空条件下加热的镀铝引线与在空气中加热老化的镀锡引线相比较,尽管两者的铜锡合金层厚度相同,但是前者的可焊性比后者要好得多。显然,进一步研究引线镀层表面的氧化与可焊性的关系,镀层表面状态乃至一些工艺因素所造成的影响,具有十分重要的意义。
Introduction In the research work on the factors that affect solderability of electronic components lead wire, people pay more and more attention to the influence of the surface properties of lead plating (including the surface oxidation resistance). Some domestic researchers pointed out that the copper-tin metal compounds only exposed to the air and air full effect, only affect the lead solderability. Under conventional aging conditions, the main reason for the decrease in solderability is the oxidation of the coating surface. The authors have also demonstrated through experiments that the aluminum-plated leads heated under vacuum have a better solderability than the tin-lead alloy with the same thickness as the copper-tin alloy lead heated in the air Much more. Obviously, further study of the relationship between the surface of the lead coating oxidation and solderability, coating surface conditions and even the impact of some process factors, is of great significance.