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一、前言大规模和超大规模集成电路向着高集成化,微细化发展的同时,其基片的尺寸也在不断地增加。为实现高精度、高速度、大尺寸基片的作图,为此电子束曝光设备突破了几项关键技术,其中卓有成效的关键技术之一,就是成功地应用了激光位置检测的工件台系统。利用激光定位的高精度,以分步/重复的作图方式,用小场拼接技术,克服了电子束偏转场尺寸的局限,实现了大尺寸基片的作图。另外由于激光测量高分辨率的特点,又可作为坐标轴系
First, the preface Large-scale and very large-scale integrated circuits towards highly integrated, miniaturization of development at the same time, the size of its substrate is also constantly increasing. To achieve high-precision, high-speed, large-size substrate mapping, electron beam exposure equipment for this break through a number of key technologies, including one of the most effective key technologies is the successful application of the laser position detection system of workpiece stage. With the high precision of laser positioning, the small field splicing technique is used in the step / repetitive patterning to overcome the limitation of electron beam deflection field size and realize the mapping of large size substrate. In addition due to the characteristics of high-resolution laser measurement, but also as a coordinate system