论文部分内容阅读
由CCLA(中国电子材料行业协会覆铜板分会)每年组织召开的《中国覆铜板技术·市场研讨会》,是国内外覆铜板业界交流技术信息的盛大集会。2014年得第十五届研讨会,拟定于2014年9月召开(具体时间、地点另行通知)。现在开始征文,具体要求如下:一、论文征集范围及内容:覆铜板、设备、仪器、上游原材料、下游印制板、终端整机电子产品等相关行业人士,均可
The “CCL Technology & Market Symposium” organized by CCLA (China Electronic Materials Industry Association CCL Branch) annually is a grand gathering for the exchange of technical information in CCL industry at home and abroad. The 15th Symposium was held in 2014 and is scheduled to be held in September 2014 (specific time and place will be announced later). Now essay, the specific requirements are as follows: First, the scope and content of the paper collection: CCL, equipment, equipment, upstream raw materials, downstream PCB, terminal 整机 electronic products and other related industries, may