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采用自制的蠕变装置研究了Sn-0.7Cu-1In无铅钎料在不同温度和压力下的压入蠕变性能,利用SEM和XRD对合金蠕变前后微观组织进行观察和分析。结果表明,随温度或应力的增加,合金的蠕变速率增大。In的加入可以增大金属间化合物与液态钎料间的界面能,使平衡状态下Cu6Sn5晶粒长大受阻,抑制高温下β-Sn枝晶相的长大,对基体起到弥散强化和细晶强化作用,提高钎料的抗蠕变性能。
The creep behavior of Sn-0.7Cu-1In lead-free solder under different temperatures and pressures was investigated by using a self-made creep device. The microstructures of the alloy before and after creep were observed and analyzed by SEM and XRD. The results show that with the increase of temperature or stress, the creep rate of the alloy increases. The addition of In can increase the interfacial energy between the intermetallic compound and the liquid brazing filler metal, so that the grain growth of Cu6Sn5 under the equilibrium state is hindered, inhibiting the growth of the β-Sn dendrite phase under high temperature, and dispersing and strengthening the matrix Crystal strengthening effect, improve the creep resistance of solder.