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提出了利用数字图像相关技术测量印刷电路板全场微应变的方法,用于评估电路板由应力所导致的失效风险,克服传统实验测试方法不能有效测量全场应变以及难以给出应变集中区域的不足。设计了基于三维数字图像相关技术和应力加载策略的实验方法,通过所获得的全场主应变分布及局部区域内应变历史曲线来评估电路板的失效风险。实验结果表明,所提出的电路板微应变测量方法的重复性优于100με,能够有效地获得电路板全场的微应变分布,尤其是能够直观地显示电路板应变超过额定值的区域分布,为改进电路板设计、降低电路板失效风险和保护电子元器件的安全提供了重要的实测数据。
A method to measure the total micro-strain of printed circuit board by using digital image correlation technique is proposed to evaluate the failure risk of circuit board caused by stress. It is difficult to measure the full-field strain and overcome the difficulty of giving the strain concentration area by traditional experimental methods insufficient. The experimental method based on 3D digital image correlation technology and stress loading strategy was designed. The failure probability of circuit board was evaluated by the distribution of the whole field main strain and the strain history curve in the local area. The experimental results show that the repeatability of the proposed micro-strain measurement method is better than 100με, which can effectively obtain the micro-strain distribution of the whole circuit board. In particular, it can directly display the regional distribution of the strain of the circuit board beyond the rated value. Improve the circuit board design, reduce the risk of circuit board failure and protect the safety of electronic components provides important measured data.