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应用于无线领域的集成电路和其它元件，它们的封装设计正处于急剧变革之中。人们对于传输大量数据的需求越来越强烈，毫无止境；因此，元器件制造商也不得不不断地改进制造技术，并同时不断地降低成本。通信和数字计算技术方面所使用的集成电路技术，正在不断地向高频率，高速
Integrated circuits and other components used in the wireless arena, their package design is in the midst of a radical change. There is a growing need and urgency for the transmission of large amounts of data; therefore, component manufacturers also have to continually improve their manufacturing techniques while simultaneously reducing their costs. Integrated circuit technologies used in communications and digital computing are constantly moving toward high-frequency, high-speed