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研究了CSP流程试制50W270高牌号无取向硅钢热轧→常化→冷轧→退火过程中织构的演变.利用电子背散射衍射技术对全流程织构进行测量和分析.发现热轧板织构在厚度方向上存在较大差异,表层主要为铜型、黄铜和高斯织构,1/4层存在微弱的高斯织构和旋转立方织构,中心层以γ纤维织构和旋转立方织构为主,还含有较弱的α纤维织构.与热轧板相比,常化板表层和1/4层织构变化不大,中心层旋转立方织构和α纤维织构增强.冷轧板各层均具有α纤维织构和γ纤维织构.与冷轧板相比,成品板各层中α纤维织构基本消失,还出现了立方织构和高斯织构.
The evolution of texture during the hot rolling → normalizing → cold rolling → annealing of 50W270 high grade non-oriented silicon steel was studied in the CSP process. The whole process texture was measured and analyzed by electron backscatter diffraction technique. In the thickness direction there is a big difference, the surface is mainly copper, brass and Gaussian texture, 1/4 layer there is a weak Gaussian texture and rotating cubic texture, the central layer to γ fiber texture and rotating cubic texture But also weak α fiber texture.Compared with hot-rolled plate, the surface texture and the ¼-layer texture of the normalized plate did not change much, and the spin-cube texture of the center layer and the α-fiber texture were enhanced. The α-fiber texture and the γ-fiber texture are present in all layers of the board, and compared with the cold-rolled sheet, the α-fiber texture in each layer of the finished sheet basically disappears, and cubic texture and Gaussian texture appear.