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为了解决传统复合钎料制备中强化颗粒容易粗化的问题,提高无铅复合钎料的性能,选用共晶Sn-3.5Ag、Sn-3.0Ag-0.5Cu钎料作为基体,3种不同类型具有纳米结构的有机-无机笼型硅氧烷齐聚物(POSS)颗粒作为增强相而制成复合钎料。研究了复合钎料的铺展性能、钎焊接头的力学性能和抗蠕变性能。结果表明,复合钎料的润湿性能均优于基体钎料的润湿性能,复合钎料钎焊接头的剪切强度和蠕变断裂寿命均明显提高。在相同条件下,Sn-Ag-Cu基复合钎料钎焊接头的性能优于Sn-Ag基复合钎料钎焊接头。
In order to solve the problem that the toughening grains are easily roughened in the preparation of the traditional composite solder and improve the performance of the lead-free composite solder, eutectic Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder are selected as the matrix, and three different types Nanostructured organic-inorganic cage-type siloxane oligomer (POSS) particles as a reinforcing phase to make a composite solder. The spreading properties of composite brazing filler metal, mechanical properties and creep resistance of brazed joints were studied. The results show that the wettability of the composite brazing filler metal is better than that of the matrix solder, and the shear strength and creep rupture life of the composite brazing filler metal joint are obviously improved. Under the same conditions, the performance of Sn-Ag-Cu-based composite brazing filler metal joint is better than that of Sn-Ag-based composite brazing filler metal joint.