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本文叙述了添加两种垫层的电容储能点焊工艺;成功地解决了渗硅钼合金薄板的连接问题。对点焊过程中出现的电极粘结、裂纹和焊点强度等关键问题进行了研究:在电极与工件表面之间垫入锡或铅箔(厚度为0.30—0.45mm),消除了电极的严重粘结;采用铌或钽箔(厚度为0.03—0.05mm),作焊点接合面的中间垫层,提高了焊点的高温强度;研究了电极端部形状对焊点产生裂纹及粘结的影响。试验证明,采用球端电极能更有效地消除焊点裂纹和粘结。通过对结合面的金相观察,这种焊点结合不是形成熔核而是在脉冲电流加热和电极压力的作用下,结合面中心区的硅层熔化并向外挤出,在钼、铌之间产生固相结合。
This paper describes the capacitor storage spot welding process with two kinds of underlayers, and successfully solves the problem of the connection of the silicon-on-molybdenum alloy sheets. Key problems such as electrode sticking, crack and solder joint strength occurred in the spot welding process were studied. A tin or lead foil (0.30-0.45 mm in thickness) was padded between the electrode and the workpiece surface to eliminate the serious electrode Bonding; the use of niobium or tantalum foil (thickness 0.03-0.05mm), as the interface between the pad pad to improve the high temperature strength of the solder joint; study of the electrode tip shape cracks and bonding of the solder joint influences. Experiments show that using ball-end electrode can more effectively eliminate solder joint cracks and bonding. Through the metallographic observation of the bonding surface, this joint does not form a nugget, but under the action of the pulse current heating and the electrode pressure, the silicon layer in the central area of the bonding surface melts and extrudes outwards, Between the solid-phase combination.