The Adhesion Improvement of Cubic Boron Nitride Film on High Speed Steel Substrate Implanted by Boro

• 作 者: CAI Zhi-hai ZHANG Ping TAN Jun
• 机 构: National Key Lab. for Remanufacturing, Inst. of Armored Force Eng. , Beijing 100072, China
• 出 处: 上海交通大学学报（英文版）
• 发表日期: 2005年4期
• 关键词: cubic boron nitride film high speed steel(HSS) ion implantation internal stress

Cubic boron nitride(c-BN) films were deposited on W6Mo5Cr4V2 high speed steel(HSS) substrate implanted with boron ion by RF-magnetron sputtering. The films were analyzed by the bending beam method, scratch test, XPS and AFM. The experimental results show that the implantation of boron atom can reduce the in tal stress and improve the adhesion strength of the films. The critical load of scratch test rises to 27.45 N, compared to 1.75 N of c-BN film on the unimplanted HSS. The AFM shows that the surface of the c-BN film on the implanted HSS is low in roughness and small in grain size. Then the composition of the boron implanted layer was analyzed by the XPS. And the influence of the boron implanted layer on the intal stress and adhesion strength of c-BN films were investigated.