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微通道热沉具有散热均匀、热扩散距离短、单位体积散热能力强等特点,已成为各种高密度、高功率电子设备高性能工作的关键器件~([1])。微通道热沉通常由多层内部镂空、图形各异的矩形薄片焊接而成,各层镂空部分构成了完整的冷却液通道。其中矩形薄片的传统制备方法包括化学腐蚀,激光切割,数控电火花加工(微机械加工)~([2]),反应离子刻蚀,电化学加工,化学辅助离子切割,热模压加工等。然而这些工艺在制造过程中或者存在一定
Microchannel heat sink has the advantages of uniform heat dissipation, short thermal diffusion distance and high heat dissipation capacity per unit volume. It has become the key component for high performance of various high density and high power electronic devices. Microchannel heat sink is usually made of multi-layer hollowed out inside, rectangular sheet of different shapes welded together, the hollow part of each layer constitutes a complete coolant channel. The traditional methods for preparing the rectangular sheet include chemical etching, laser cutting, CNC EDM (micromachining) ~ ([2]), reactive ion etching, electrochemical machining, chemical assisted ion cutting, hot stamping and the like. However, these processes in the manufacturing process or there is some