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微电子封装一般可分为三级封装,即用封装外壳(金属、陶瓷、塑料等)封装成单芯片组件(SCM)和多芯片组件(MCM)的一级封装,常称芯片级封装;将一级封装和其它元器件一同组装到基板(PWB或其它基板)上的二级封装,又称板级封装;以及再将二级封装组装到母板上的三级封装,这一级也称为系统级封装。(而一、二级封装的关系更加密切,已达到技术上的融合)。
Microelectronic packages generally can be divided into three levels of packages, that is, packaged in single-chip packages (SCMs) and multi-chip packages (MCMs) in a package enclosure (metal, ceramic, plastic, Level one package and other components together to the substrate (PWB or other substrates) on the second-level package, also known as board-level package; and then the second-level package assembly to the motherboard on the three-level package, this level is also called System-in-package. (And one, two packaging closer relations, has reached the technical integration).