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为实现钨与铜的冶金可靠连接,采用浸渗法在纯钨材料表面制备一层含镍涂层。利用SEM及EDS研究不同浸渗熔体所对应的涂层/钨界面显微组织与成分分布。结果表明:于1 500℃温度通过Ni-Fe、Ni-Cu、Ni三种熔体浸渗,钨材表面对应形成的Ni-Fe涂层、Ni-Cu涂层、Ni涂层均与钨实现了冶金结合;Ni-Fe涂层对应的钨界面形成了由圆滑W颗粒相和少量粘结相组成的钨基高密度合金组织;在Ni涂层中,沿钨界面形成了厚1～2μm、由NiW和NiW2组成的化合物层。结合实验结果及W-Ni二元相图,分析了涂层/钨界面组织的形成机制。
In order to achieve a reliable metallurgical connection between tungsten and copper, a nickel-containing coating is prepared on the surface of the pure tungsten material by impregnation. The microstructure and composition distribution of coating / tungsten interface corresponding to different infiltrated melts were studied by SEM and EDS. The results show that Ni-Fe coating, Ni-Cu coating and Ni coating formed on the surface of tungsten material are all impregnated with tungsten through infiltration of Ni-Fe, Ni-Cu and Ni at 1 500 ℃. And the metallurgical bonding. The tungsten interface corresponding to the Ni-Fe coating formed a tungsten-based high-density alloy consisting of a smooth W phase and a small amount of binder phase. In the Ni coating, a thickness of 1 to 2 μm was formed along the tungsten interface, A compound layer composed of NiW and NiW2. Based on the experimental results and W-Ni binary phase diagram, the formation mechanism of the coating / tungsten interfacial microstructure was analyzed.