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Ｘｉｌｉｎｘ于日前宣布，在其最新推出 的Ｖｉｒｔｅｘ－ＥＭ产品中率先与ＵＭＣ合作采用０．１８微米铜工艺制造，这是业界首次采用基于钢连线工艺生产ＦＰＧＡ产品，同时也使公司继最早推出０．２５微米和０．１８微米技术后再次成为全球第一。该产品预计将于今年下半年量产
Xilinx announced today that it is the first in its latest Virtex-EM portfolio to partner with UMC in the 0.18-micron copper process, which is the industry’s first FPGA-based production of steel-based connection technology and the company’s first launch of 0 .25 micron and 0.18 micron technology once again become the world’s first. The product is expected to mass production in the second half of this year