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良好的润湿性是优质焊料的重要指标,同时也可以为复合无铅焊料的开发提供必要的研究基础。而工业过程中的操作表面往往是倾斜的,因此,研究倾斜状态下的润湿特性更能反映实际情况。本文采用静滴法研究了不同温度下Sn-3.5Ag合金熔体在Cu,Ni材料水平基板和倾斜基板上的润湿行为与界面相互作用,分析了润湿机理。结果表明,Sn-3.5Ag合金与固体Cu基板在(494～744)K时的平衡接触角为139.2°～33.3°,接触角滞后为82.1°～47.8°。Sn-3.5Ag合金与固体Ni基板在(494～744) K时的接触角分别为140.8°～41.5°,接触角滞后为92°～60.9°。在不同温度下Sn-3.5Ag合金熔体在不同温度下与固体Cu基板之间有良好的润湿性且为反应性润湿。Sn-3.5Ag熔体与基板Cu之间的界面产物是由Cu_6Sn_5及Cu_3Sn所组成。用三相界面平衡的界面张力关系式分析了Sn-3.5Ag合金与Cu基板的三相界面,符合较好。Sn-3.5Ag对Ni基板的润湿过程也是反应性润湿。
Good wettability is an important indicator of high-quality solder, but also can provide the necessary research foundation for the development of composite lead-free solder. However, the operating surface in industrial process tends to be inclined. Therefore, the study of the wetting characteristics under inclined conditions can better reflect the actual situation. In this paper, the wetting behavior and interfacial interaction of Sn-3.5Ag alloy melt on Cu and Ni substrates and on inclined substrates at different temperatures were studied by the drop-in-drop method. The wetting mechanism was analyzed. The results show that the equilibrium contact angle of Sn-3.5Ag alloy with solid Cu substrate at (494 ~ 744) K is 139.2 ° ~ 33.3 °, and the contact angle hysteresis is 82.1 ° ~ 47.8 °. The contact angles of Sn-3.5Ag alloy and solid Ni substrate at (494-744) K were 140.8 ° -41.5 °, respectively, and the contact angle hysteresis was 92 ° -60.9 °. The Sn-3.5Ag alloy melt has good wettability with solid Cu substrate at different temperatures and reactivity wetting at different temperatures. The interfacial product between Sn-3.5Ag melt and Cu substrate consists of Cu_6Sn_5 and Cu_3Sn. The three-phase interface of Sn-3.5Ag alloy and Cu substrate was analyzed by the interfacial tension relationship of three-phase interface, which is in good agreement. Sn-3.5Ag wetting of Ni substrate is also reactive wetting.