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本文研究了交流离子渗氮动力学,结果表明,渗层表面氮浓度在半小时即达到定值,延长渗氮时间,其值维持不变;化合物层和扩散层层深长大动力学均符合抛物线规律。研究了不同工艺参数对工频交流离子渗氮动力学的影响,并与直流离子渗氮进行比较,研究表明:在N_2∶H_2<8∶2时,直流离子渗氮的表面氮浓度和渗层深度均大于交流离子渗氮的;当 N_2∶H_2≥8∶2时,两者差别消失;其他工艺参数对交流离子渗氮动力学的影响,与直流离子渗氮相似。
In this paper, the kinetics of AC ion nitriding was studied. The results showed that the nitrogen concentration on the surface of the diffusion layer reached the set value in half an hour, and the nitriding time was prolonged. The long-term kinetics of the compound layer and diffusion layer were in agreement with the parabola law. The effect of different process parameters on the frequency of AC ion nitriding kinetics was studied and compared with that of DC ion nitriding. The results showed that the surface nitrogen concentration of DC ion nitriding and nitrided layer at N_2:H_2 <8: 2 The depth is greater than the AC ion nitriding; when N_2:H_2≥8: 2, the difference between the two disappears; other process parameters on the AC ion nitriding kinetics, and DC ion nitriding is similar.