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采用单辊旋淬法制备Au-19.25Ag-12.80Ge钎料薄带,利用差热分析仪、SEM及TEM对钎料薄带的熔化特性及显微组织进行了观察分析,并对其与Ni的焊接性能加以研究。结果表明:单辊旋淬法制备Au-19.25Ag-12.80Ge钎料薄带的液相线温度比钎料母合金有所降低,熔化温度区间缩小了约4℃;单辊旋淬工艺使钎料薄带显微组织分布均匀且显著细化,近辊面一侧形成了尺寸40～50nm的纳米晶层,沿薄带厚度方向存在组织突变,这种突变是由存在的临界冷却速度造成的。钎料薄带与Ni基体表面润湿优良,形成了可靠的冶金结合界面,在相同条件下与Ni的焊接接头抗剪强度比钎料母合金形成的焊接接头提高了近60%。
Au-19.25Ag-12.80Ge solder ribbons were prepared by single-roller spin-quenching method. The melting characteristics and microstructure of the solder ribbons were observed and analyzed by means of differential thermal analyzer, SEM and TEM. Of the welding performance to be studied. The results show that the liquidus temperature of Au-19.25Ag-12.80Ge filler ribbon prepared by single roller spin-casting is lower than that of solder master alloy, and the melting temperature range is reduced by about 4 ℃. The microstructure of the material ribbon is distributed uniformly and remarkably. The nanocrystalline layer with the size of 40 ~ 50nm is formed on the near roll surface, and the microstructure is abruptly changed along the thickness direction of the thin strip. This abrupt change is caused by the existence of the critical cooling rate . The brazing filler metal strip and the Ni matrix have excellent wettability and form a reliable metallurgical bonding interface. The shear strength of the welded joint with Ni is increased by nearly 60% compared with that of the solder parent alloy under the same conditions.