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采用丝束电极方法结合电化学阻抗技术研究了Cu在0.6 mol/LNaCl液滴下的腐蚀行为。结果表明:液滴下Cu电极表面表现出明显的不均匀电流分布特征,开始时呈现中心阴极边缘阳极的分布,随腐蚀时间的延长电流分布会发生极性反转,呈现中心阳极边缘阴极的分布。对电极表面形貌及产物的分析结果表明,开始时液滴边缘区即有红棕色产物大量积累,而中心区氧化膜生成则较慢。随着腐蚀时间的延长,电极表面逐渐被红棕色氧化膜完全覆盖,中心区氧化膜开始破坏并生成绿色产物,其破坏程度强于边缘区。据此对液滴下Cu的腐蚀机理进行探究。
The corrosion behavior of Cu under 0.6 mol / L NaCl droplet was studied by using tow wire method combined with electrochemical impedance technique. The results show that the surface of the Cu electrode shows obvious non-uniform current distribution characteristics. The distribution of the anode at the edge of the center cathode begins to appear. With the extension of the corrosion time, the current distribution reverses in polarity, showing the distribution of cathodes at the center anode. The analysis of the electrode surface morphology and product showed that there was a large accumulation of reddish brown products in the edge of the droplet at the beginning, and the oxide film in the center was slower. With the extension of the etching time, the surface of the electrode was gradually covered by the red-brown oxide film, the oxide film in the center began to destroy and produce green product, which was more damaged than the edge region. Based on this, the corrosion mechanism of Cu under liquid droplet was explored.