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本文把文献中提出的疲劳断裂机制图同疲劳失效分析结合起来,举出了三个应用的例子。第一个用机制图分析疲劳裂纹的扩展过程,第二个用机制图判断受载的大小,第三个用来分析热处理不当的影响。结果表明,把疲劳断口的电子显微特征,特别是源区的断裂机制同疲劳断裂机制图相对照,就可分析零件的受载大小,裂纹扩展状态,为判断零件的断裂过程及其失效原因,改进材料和工艺提供线索。
In this paper, the fatigue fracture mechanism proposed in the literature is combined with fatigue failure analysis, and three examples are given. The first one uses a mechanistic graph to analyze the fatigue crack propagation process, the second uses a mechanistic graph to determine the size of the load, and the third one to analyze the effects of improper heat treatment. The results show that the electron microscopic characteristics of the fatigue fracture, especially the fracture mechanism of the source region, can be compared with the fatigue fracture mechanism to analyze the load size and crack propagation state of the part. In order to judge the fracture process of the part and its failure reason , Improve materials and processes provide clues.