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采用超声频信号调制的电火花脉冲电源与超声波复合进行抛光研磨加工的新技术,对导电陶瓷材料抛光效率比单纯超声波抛光高5倍以上,表面粗糙度 Ra=0.05μm。
Ultrasonic signal modulation using spark pulse power and ultrasonic polishing combined with polishing new technology, the polishing efficiency of conductive ceramic material than the ultrasonic polishing more than 5 times higher than the surface roughness Ra = 0.05μm.