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专利申请号:CN200910041036.3公开号:CN101654560申请日:2009.07.10公开日:2010.02.24申请人:茂名市信翼化工有限公司;柯松本发明公开了一种功率型LED封装用的有机硅材料及其合
Patent application number: CN200910041036.3 Publication Number: CN101654560 Publication date: 2009.07.10 Date of publication: 2010.02.24 Applicant: Mowei Xinyi Chemical Co., Ltd .; Ko Son The present invention discloses a power LED package for the silicone material And their combination