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1 前言1994年开始大批量生产16MDRAM,作为研究开发阶段也是从以64MDRAM 为代表的0.4μm 器件过渡到以256MDRAM 为代表的0.25μm 器件。对于64M 方面的设备投资究竟是多少,各器件公司要先进行核算,结果是设备投资增加了许多。如果说以往是重视性能方面而选择机种,那么,今后的趋势则转为重视成本。另外,如图1所示,尽量控制批量生产初期的投资额,使处理能力和投资金额呈线性关系,希望能获得具有多种处理能力的装置。作为机种选择指标之一的是 COO(Cost of Ownership)。其中,除了装置的成本之外,还包括消耗品和动力费等运转成本、维修人员的人事费用,这都要作为处理每枚硅片所需要的成本。
1 Introduction Starting mass production of 16MDRAM in 1994, as a research and development phase also transition from 0.4μm devices represented by 64MDRAM to 0.25μm devices represented by 256MDRAM. For the 64M investment in equipment is how much, the device companies must first accounting, the result is a substantial increase in investment in equipment. If the past is to focus on performance and choose models, then the future trend is to focus on cost. In addition, as shown in Figure 1, try to control the amount of initial investment in mass production, the processing capacity and the amount of investment was a linear relationship, hoping to get a multi-processing capacity of the device. As one of the model selection indicators is the COO (Cost of Ownership). Among them, in addition to the cost of the device, it also includes operating costs such as consumables and power costs, personnel costs for maintenance personnel, which are all required as costs for handling each wafer.