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激光加工设备与技术综述2000O10119飞秒激光加工=フェムト V一十一加工[日]/绿川克美//O plus E.—1999,21(9).—1130～11362000010120辐射光激发加工的现状与展望=放射光励起7”o七只盯现状上将来展望[日]/宇理须恒雄//一十一研究.—1998.26(6).—438～4432000010121激光加工用大功率全团体化的激光技术=L一十—加工用高出力完全固体比v一仔一技术[日 ]/佐藤雅夫.内藤真哉/卜一千一研究.—1999.27(10).—688～693
Laser Processing Equipment and Technology 2000O10119 Femtosecond Laser Processing = Fm11 processing [Japan] / Green River grams of the United States / / O plus E.-1999,21 (9) .- 1130 ~ 11362000010120 The status of the radiation excitation processing and Prospects = Radiation Light Excitement 7 "o Seven Stares into the Present and Future Prospects [Japan] / Ulysse Heng-hsiung // Eleven Studies. -1998.26 (6) .- 438 ~ 4432000010121 High-power, all-encompassing laser technology for laser processing = L ten - the processing of high solid force than the force of a child Aberdeen [Japan] / Sato Yoshio. Naito Makoto / Bu one thousand one study. -1999.27 (10) .-688 ~ 693