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Ag -Sn -M(M =Bi、Cu)合金粉末内氧化后经压制、烧结、挤压、加工制备成Ag-SnO2 接点材料。用光学显微镜 ,X射线衍射和SEM研究其显微结构。结果表明 :在Ag-SnO2 材料中存在Ag、SnO2 、Bi2 SnO7和CuO ,氧化物以极细小的颗粒分布在银基体中。
The Ag-Sn-M (M = Bi, Cu) alloy powder is oxidized and then pressed, sintered, extruded and processed into the Ag-SnO2 contact material. The microstructure was studied by light microscopy, X-ray diffraction and SEM. The results show that Ag, SnO2, Bi2 SnO7 and CuO are present in the Ag-SnO2 material. The oxides are distributed in the silver matrix with extremely fine particles.