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印刷电路板的EMC性能机架电磁干扰和印刷电路板布局之间的相关性研究对集成电路PCB板中与地相连的导电机架辐射发射的研究表明,PCB中与导电机架相连发射会更强。同时,结果也显示出地层、PCB板和机架之间的接地点所在位置不同会影响到辐射水平的增高,这种影响有时可以高达9 dB。为了查出噪声电流从PCB扳到机架的路径,我们用细电流探头对他们之间的节点电流进行测量。节点电流频谱的位置关系式与辐射谱相关。此外,电磁干扰的水平与从螺丝到最近的旁路电容之间的距离有关。
EMC performance of printed circuit board Research on the correlation between rack electromagnetic interference and PCB layout Radiated emission from conductive chassis connected to ground in integrated circuit (PCB) boards has shown that PCBs connected to conductive chassis can emit more Strong. At the same time, the results also show that different levels of ground points between the stratum, the PCB and the rack affect the level of radiation, sometimes up to 9 dB. In order to find the path where the noise current is pulled from the PCB to the rack, we measure the node current between them with a fine current probe. The location relationship of the node current spectrum is related to the radiation spectrum. In addition, the level of EMI is related to the distance from the screw to the nearest bypass capacitor.