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随着电子整机的多功能化、小型化,半导体元器件装配用的基板线条也逐渐趋于微细化。印制电路板一般用的铜箔(以下称为一般铜箔)表面都经过了粗糙化处理,在蚀刻成为线路时,铜箔的粗糙化部分嵌入粘合结构中很难蚀刻干净,所以不适合制作精细线条的印制电路板。为此,日立化成公司研发成功了一种表面不进行粗糙化处理,表面粗糙度在1.5μm以下,表面较平滑适合于制作精细印制电路的铜箔(以下称无粗糙化铜箔)。一般认为,表面平滑的铜箔其抗剥强度较低;但这种新开发的铜箔表面经过了特殊处理,仍然与低轮廓铜箔相当,保持0.7kN/m以上的抗剥强度。采用这种无粗糙化铜箔,以减成法可蚀刻成60μm线宽的精细线路,并顺利地进行无电镀镍/金工艺作业,减少了对镀液的污染。当前正处于高速度、大容量的信息化时代,使用这种新型铜箔的线路与一般铜箔者相比,同样是传输5GHz的信号,线路的衰减将降低8dB/m。此项技术将对高速印制电路板基材的研发起到积极作用。
As electronic multi-functional machine, miniaturization, semiconductor components used in the assembly of substrate lines are gradually becoming more refined. Printed circuit board generally used copper foil (hereinafter referred to as the general copper foil) have been roughened on the surface, in the etching circuit, the roughened portion of the copper foil embedded in the adhesive structure is difficult to etch clean, it is not suitable Production of fine lines of printed circuit boards. To this end, Hitachi Chemical has developed a successful R & D of a surface without roughening, surface roughness of 1.5μm below, the surface is relatively smooth for the production of fine printed circuit copper foil (hereinafter referred to as roughened copper foil). Copper foil with a smooth surface is generally considered to have a low peel strength; however, the newly developed copper foil has been specially treated to a surface that is still comparable to low-profile copper foil and maintains a peel strength of 0.7 kN / m or more. The use of such a roughened copper foil to reduce the method can be etched into 60μm line width fine lines and smooth electroless nickel / gold process operations, reducing the pollution of the bath. Currently in the high-speed, high-capacity information age, the use of this new type of copper foil compared with the general copper foil, the same transmission of 5GHz signal, the line attenuation will be reduced 8dB / m. This technology will play an active role in the research and development of high speed printed circuit board substrates.