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讨论了环氧基材PCB对无铅焊锡装配的适应性、铜通孔的可靠性,证明双氰胺固化的环氧基材不能适应无铅焊锡装配;酚醛树脂固化的环氧基材有解决此问题可能性,但都是PCB制造商们的技术决窍.
The adaptability of epoxy substrate PCB to lead-free solder assembly and the reliability of copper through-hole were discussed, indicating that dicyandiamide-cured epoxy substrate could not be adapted to lead-free solder assembly; phenolic resin-cured epoxy substrate was solved The possibility of this problem, but are PCB manufacturers know-how.