论文部分内容阅读
一、引言取代普通插装技术的一种理想技术——表面安装技术,目前已发展到第二阶段:努力解决几个重大问题。为挖掘表面安装的潜力,目前要集中解决两年前就表现有严重影响的那些问题,例如标准、元件、互连和生产设备。元件和PC基板的标准目前已经形成,但尚未定稿。大多数通用元件如电阻器、电容器和电感器都已成功地用于表面安装。下一步要突破“电惰性”元件如电路板边缘接插件和DIP型开关的使用。系统设计师还着手改善样机和测试线路所要求解决的一些问题。
I. INTRODUCTION An ideal technology that replaces ordinary plug-in technology - surface mount technology, has now developed to the second stage: trying to solve several major problems. To tap the potential of surface mount installations, there is currently a focus on those issues that have had a serious impact on performance two years ago, such as standards, components, interconnects and manufacturing equipment. Standards for components and PC substrates are currently in place but have not yet been finalized. Most common components such as resistors, capacitors, and inductors have been successfully used for surface mounting. The next step is to break through the use of “electrically inert” components such as circuit board edge connectors and DIP switches. System designers are also working on some of the issues that are required to be solved by prototypes and test circuits.