多场耦合时效对微焊点界面组织与性能的影响

• 作 者: 张春红 张宁 高尚 张信永 赵伟
• 机 构: 徐州生物工程职业技术学院机电工程系徐州市绿色洁净复合钎料工程技术研究中心,徐州工程学院江苏省大型工程装备检测与控制重点建设实验室,
• 出 处: 金属热处理
• 发表日期: 2017年03期
• 关键词: 多场耦合 界面组织 降速 抛物线型 断裂机理 解理断裂 热端 拉伸断口 钎料 钎焊接头

模拟复杂环境中的热场、电场、磁场和力场四维场合,设计制作了多场耦合时效装置,研究了Cu/Sn58Bi-0.05Sm/Cu微焊点在25、50、100和200 h的多场耦合时效过程中,界面金属间化合物的微观组织变化和力学行为。结果表明:随着时效时间的延长,焊点热端(阳极)的IMC层平整饱满,逐渐变厚,而冷端(阴极)呈现锯齿形,逐步变薄,出现大量的空位和空洞,并形成裂纹;焊点抗拉强度呈抛物线型下降,时效初期抗拉强度降速较大,之后降速逐渐减缓;拉伸断口逐步呈现小裂纹→单一大裂纹→多条大裂纹的现象,断裂机理为解理断裂,焊点的可靠性不断降低。

In order to simulate the thermal field, electric field, magnetic field and force field in complex environment, a series of coupled aging devices were designed and fabricated. The effects of Cu / Sn58Bi-0.05Sm / Cu micro-welding spots on 25, 50, 100 and 200 h Field Coupling Aging, Interfacial Intermetallics Microstructural Changes and Mechanical Behavior. The results show that with the aging time increasing, the IMC layer in the hot spot (anode) of solder joint is flat and full, gradually thickening, while the cold end (cathode) shows zigzag shape, gradually thinning, a large number of vacancies and voids appear and form Crack; the tensile strength of the solder joints showed a parabolic decline, and the initial tensile strength decelerated at a relatively early stage, then the deceleration slowed down gradually; the phenomenon of small cracks → single large cracks → multiple large cracks gradually appeared in the tensile fracture; Cleavage fracture, the reliability of solder joints continue to decrease.