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采用循环伏安和计时安培法研究了羟基乙叉二膦酸(HEDPA)镀铜液中铜在玻碳电极上电结晶的初期行为.结果表明:羟基乙叉二膦酸(HEDPA)镀铜体系中,铜的电沉积过程经历了晶核形成过程;当溶液中不含CO32-时,其电结晶按连续三维成核方式进行,而随着CO32-的逐渐加入,使得铜电结晶按瞬时三维成核方式过渡;成核数密度都随着电位的提高而增加.这可能是CO32-以第二配体形式进入HEDPA和Cu2+构成的络合结构,从而形成更稳定的络合物吸附在电极表面所致.
Cyclic voltammetry and chronoamperometry were used to study the initial behavior of copper electrocrystallization on the glassy carbon electrode in HEDPA copper plating solution.The results showed that the electrodepositing behavior of HEDPA copper plating system , The electrodepositing process of copper underwent the process of nucleation. When the solution did not contain CO32-, its electrocrystallization proceeded in a continuous three-dimensional nucleation mode. With the gradual addition of CO32-, Nucleation density transitions increase with the increase of potential, which may be due to CO32- entering the complex structure of HEDPA and Cu2 + as the second ligand to form a more stable complex adsorbed on the electrode Surface caused.