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随着移动终端的广泛应用,射频多芯片系统封装结构的小型化、系统的集成化将导致功率密度的直线上升,同时,芯片各异性的特点将产生温度分布不均的现象,从而催生亟需解决的热管理问题。针对包含5款芯片的典型的射频前端系统,在POP封装基础上,提出柔性基板封装结构设计方案,并应用ANSYS ICEPAK三维数值分析法进行仿真计算,验证得到如下结果:1柔板同层的温差降低到POP结构的6%,异层的温差降低到POP结构的4%,避免了热点的出现;2柔板封装结温随下层屏蔽罩的厚度增大而减小,但尺寸的变化对其影响相对较小;3与铝基相比,铜屏蔽罩能够起到更好的散热作用。研究结果为射频异构多芯片三维封装优化设计提供了参考方案。
With the widespread use of mobile terminals, the miniaturization of the RF multi-chip package structure and the system integration will lead to a linear increase of the power density. Meanwhile, the heterogeneity of the chips will result in the phenomenon of uneven temperature distribution, which urgently needs to be urgently needed Solve the thermal management issues. Aiming at the typical RF front-end system containing 5 chips, a design proposal of flexible substrate package structure based on POP package is proposed. The simulation results using ANSYS ICEPAK three-dimensional numerical analysis show that the following results are obtained: 1. Reduced to 6% of the POP structure, the temperature difference between different layers reduced to 4% of the POP structure, to avoid the hot spots; 2 flex board package junction temperature decreases with the thickness of the lower shield increases, but the size changes its Impact is relatively small; 3 compared with the aluminum base, copper shield can play a better heat dissipation. The research results provide a reference scheme for the optimization design of RF heterogeneous multi-chip 3D packaging.