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采用界面弹性-软化内聚力模型,用解析法研究了单纤维/聚合物基体复合材料高温固化后的残余应力分布。结果表明:较高固化温度引起界面软化和脱粘;纤维中残余应力分布由应力增长区和应力平台区组成,残余应力平台值与固化温度及纤维和基体热膨胀系数差值成正比,界面参数只对残余应力增长区的分布有影响;在界面断裂韧性相同情况下,界面弹性模量增加缩短应力传递长度,界面软化模量增加减少软化长度,弹性和软化模量变化不影响界面脱粘的温度。
The interfacial elasticity-softening cohesion model was used to study the residual stress distribution after single-fiber / polymer matrix composite was cured at high temperature by analytical method. The results show that the higher curing temperature causes the interface softening and debonding. The residual stress distribution in the fiber is composed of stress growth zone and stress platform zone. The residual stress platform value is directly proportional to the curing temperature and the difference of thermal expansion coefficient between fiber and matrix. The distribution of residual stress growth zone is affected. Under the same interface fracture toughness, the increase of interfacial elastic modulus shortens the length of stress transfer, and the increase of interface softening modulus decreases the softening length. The change of elasticity and softening modulus does not affect the temperature of interfacial debonding .