热电器件综合性能表征系统及实验研究

• 作 者: 朱建军 李震 张兴
• 机 构: 热科学与动力工程教育部重点实验室,清华大学工程力学系,
• 出 处: 工程热物理学报
• 发表日期: 2013年01期
• 关键词: thermoelectric conversion figure of merit Harman method Seebeck coefficient

基于直流瞬态Harman法测量热电器件优值系数原理,搭建热电器件综合性能表征实验系统,实现同时测量热电器件无量纲优值系数(ZT值)、Seebeck系数、电导率以及热导率,并通过Labview编程完成对实验系统的控制、数据采集、实时显示和处理。制作并改进具有夹层结构的热电器件,对此开展了性能测试评估。实验结果表明,室温下夹层结构热电器件ZT值小于常规Bi_2Te_3器件,但Seebeck系数比常规器件大;夹层结构器件电导率和热导率均大于常规器件值。

Based on the principle of direct current transient Harman method to measure the merit coefficient of thermoelectric devices, a comprehensive characterization experimental system of thermoelectric devices was set up to measure the dimensionless merit (ZT) value, the Seebeck coefficient, the electric conductivity and the thermal conductivity of the thermoelectric devices simultaneously. Labview programming to complete the experimental system control, data acquisition, real-time display and processing. A thermoelectric device with a sandwich structure was made and improved, and a performance test evaluation was conducted. The experimental results show that the ZT value of the sandwich structure thermoelectric device is smaller than that of the conventional Bi 2 Te 3 device at room temperature, but the Seebeck coefficient is larger than that of the conventional device. Both the conductivity and the thermal conductivity of the sandwich structure device are larger than those of conventional devices.