论文部分内容阅读
采用润湿平衡法研究Yb对Sn-Cu-Ni无铅钎料在铜基板表面的润湿性能,探讨QFP32器件Sn-Cu-NiYb焊点的力学性能和断口形貌。结果表明,微量的Yb可以显著减小Sn-Cu-Ni钎料润湿角,提高QFP器件焊点的力学性能,但是过量Yb的添加,会导致钎料和焊点性能的恶化,主要归因于大块稀土相(脆性相)的生成和稀土的氧化严重。对Sn-Cu-Ni-x Yb钎料成分优化设计,发现Yb的最佳添加量为0.05%~0.06%。
Wetting equilibrium method was used to study the wettability of Yb on Sn-Cu-Ni lead-free solder on the surface of copper substrate. The mechanical properties and fracture morphology of Sn-Cu-NiYb solder joints were investigated. The results show that the trace amount of Yb can significantly reduce the wetting angle of Sn-Cu-Ni solder and improve the mechanical properties of QFP solder joints. However, the addition of excessive Yb leads to the deterioration of solder and solder joints, The formation of large rare earth phase (brittle phase) and the oxidation of rare earth serious. Optimum composition of Sn-Cu-Ni-x Yb solder composition, found that the optimum amount of Yb added 0.05% to 0.06%.