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采用化学镀法在纯铜基体上镀上镍-磷镀层,并通过液固复合铸造工艺制备Al/Cu双金属材料。研究不同工艺参数(结合温度、预热时间)下Al/Cu接头的显微组织、力学性能和导电性能。结果表明,各种金属间化合物在界面处形成,其厚度和种类随结合温度和预热时间的增加而增加。Ni-P夹层发挥了扩散阻碍层和保护膜的作用,有效地减少了金属间化合物的形成。Al/Cu双金属复合材料的剪切强度和电导率随金属间化合物厚度的增加而减小,特别地,Al_2Cu相的不利影响相比其他金属间化合物更加明显。在780°C预热150 s条件下制备的试样表现出最大的剪切强度和电导率,其值分别为49.8 MPa和5.29×10~5 S/cm。
Electroless plating was used to coat Ni - P coating on pure copper substrate and Al / Cu bimetallic material was prepared by liquid - solid compound casting process. The microstructure, mechanical properties and electrical conductivity of Al / Cu joints under different process parameters (bonding temperature, preheating time) were studied. The results show that various intermetallics are formed at the interface, and their thickness and type increase with the increase of bonding temperature and preheating time. The Ni-P interlayer acts as a diffusion barrier and a protective film, effectively reducing the formation of intermetallic compounds. The shear strength and electrical conductivity of Al / Cu bimetallic composites decrease with the increase of intermetallic compound thickness. In particular, the adverse effect of Al 2 Cu phase is more obvious than other intermetallic compounds. The samples prepared at 780 ° C for 150 s preheated exhibited the highest shear strength and conductivity of 49.8 MPa and 5.29 × 10 -5 S / cm, respectively.