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In this research, a nano-Mo2 C particle dispersion-strengthened copper alloy was prepared by a novel method, i.e., electron beam physical vapor deposition(EBPVD) which has advantages of simple technical process and low cost compared with the conventional mechanical alloying method. And the microstructure and properties of the material were investigated. The results show that the copper matrix is composed of columnar crystals with the average width of 7 lm, and the size of Mo2 C dispersoid is1–7 nm. The ultimate tensile strength of the material is486 MPa, and the electrical conductivity is 82 % IACS. As the temperature increases from 293 to 573 K, the material becomes more brittle.
In this research, a nano-Mo2 C particle dispersion-strengthened copper alloy was prepared by a novel method, ie, electron beam physical vapor deposition (EBPVD) which has advantages of simple technical process and low cost compared with the conventional mechanical alloying method. And the microstructure and properties of the material were investigated. The results show that the copper matrix is composed of columnar crystals with the average width of 7 lm, and the size of Mo2 C dispersoid is 1-7 nm. The ultimate tensile strength of the material is486 MPa, and the electrical conductivity is 82% IACS. As the temperature increases from 293 to 573 K, the material becomes more brittle.