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Silicon Labs日前为其Wireless Gecko片上系统(SoC)和模块产品组合发布了新的动态多协议软件,可同时在单一SoC上运行在Zigbee和低功耗蓝牙,汇集了这两种协议的关键应用优势。这种多协议解决方案可实现物联网(IoT)应用的高级功能,且不会带来双芯片架构的额外复杂性和硬件成本,从而将无线子系统物料清单(BOM)成本和尺寸降低达40%。施耐德电气Smart Space业务高级副总裁Nico Jonkers表示:“多协议技术是IoT无线连接的未来。Silicon Labs的多
Silicon Labs today announced new dynamic multiprotocol software for its Wireless Gecko System-on-Chip (SoC) and module portfolio that runs on Zigbee and Bluetooth Low Energy simultaneously on a single SoC, bringing together the key application benefits of both protocols . This multi-protocol solution reduces the cost and size of the wireless subsystem bill of materials (BOM) by up to 40 percent by enabling the advanced features of an Internet of Things (IoT) application without introducing the additional complexity and hardware costs of a two-chip architecture %. Nico Jonkers, senior vice president, Smart Space Business, Schneider Electric, said: ”Multiprotocol technology is the future of IoT wireless connectivity.