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用常规的X射线法测定磨削应力时,通常引起2θ—sin~2φ曲线分离现象,因此,不能准确地测定磨削应力。本文用Dlle—Cohen法测得应力,并用迭片法测得沿层深的应力分布。所得结果如下:磨削表层为三维应力状态,沿层深具有很大的应力梯度,约在离表面10μm处存在应力峰。沿加工方向测得2θ-sin~2φ曲线产生分离现象,而垂直磨削方向不发生。2θ-sin~2φ曲线分离是由于主应力平面不平行试样表面而引起的。
When the grinding stress is measured by a conventional X-ray method, 2θ-sin ~ 2φ curve separation usually occurs, and therefore, the grinding stress can not be accurately measured. In this paper, the stress is measured by the Dlle-Cohen method and the stress distribution along the deep layer is measured by the lamination method. The results are as follows: Grinding the surface of the three-dimensional state of stress, deep along the layer has a large stress gradient, about 10μm at the surface there is a stress peak. The 2θ-sin ~ 2φ curve measured along the machine direction results in a separation, whereas the vertical grinding direction does not occur. 2θ-sin ~ 2φ curve separation is due to the main stress plane is not parallel to the sample surface caused.